Chip model: TEC1-12703
Dimensions: 40*40*4.0mm±0.1 Number of component pairs 127
Wire specification: lead length 310mm±5mm RV standard wire single head 5mm tin-plated
Internal resistance: 4.0~4.3Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax=3 (when starting at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 27W
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃～83℃ (too high ambient temperature drop directly affects cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packing standard: foam box packaging, storage conditions Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Chip model: TEC1-12704
Dimensions: 40*40*4.2mm Number of component pairs 127
Wire specification: lead length 100±5mm RV standard wire single head 5mm tin plated
Internal resistance: 3.0~3.3Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax=4 (when starting at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 36W
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃～83℃ (too high ambient temperature will directly affect the cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packing standard: foam box packaging, storage conditions Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Chip model: TEC1-12705
Dimensions: 40*40*3.8mm Number of component pairs 127
Wire specification: lead length 100±5mm RV standard wire single head 5mm tin plated
Internal resistance: 2.4~2.7Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: △Tmax(Qc=0) above 61℃.
Working current: Imax=5 (when the rated voltage starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 45W
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃～83℃ (too high ambient temperature will directly affect the cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packing standard: foam box packaging, storage conditions Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Chip model: TEC1-12706 (different batches may have different printing)
External dimensions: 40*40*3.75mm
Internal resistance: 2.1~2.4Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: △Tmax(Qc=0) above 67℃.
Working current: Imax=4-6A (at rated 12V)
Rated voltage: 12V (Vmax: 15V starting current 5.8A)
Refrigeration power: Qcmax50-60W
Working environment: temperature range -55℃～83℃ (too high ambient temperature drop directly affects cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Chip model: TEC1-12708
Dimensions: 40*40*3.5mm Number of component pairs 127
Wire specification: lead length 300±8mm RV standard wire single end 5mm tin plated
Internal resistance: 1.5~1.8Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: △Tmax(Qc=0) above 67℃.
Working current: Imax=8A (when starting at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 77W
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃～83℃ (too high ambient temperature will directly affect the cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packing standard: foam box packaging, storage conditions Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Chip model: TEC1-12709
High current ImaxA: 9A
Large temperature difference△Tmax:68℃
Large voltage Vmax (Qc=Ow): 15.2V
Resistance: 1.4Ω
(Hot end temperature TH=27℃): 82W
Number of component pairs: 127
Dimensions L.B.H (mm): 40*40*3.4±0.1MM
Chip model: TEC1-12710
Dimensions: 40*40*3.4mm Number of component pairs 127
Wire specification: lead length 300±5mm RV standard wire single head 5mm tin-plated
Internal resistance: 1.2~1.5Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax=10A (when 15Vmax voltage starts)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 92W
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃～83℃ (too high ambient temperature will directly affect the cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packing standard: foam box packaging, storage conditions Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Chip model: TEC1-12715
Dimensions: 40*40*3.2mm Number of component pairs: 127 pairs
Wire specification: lead length 200±8mm RV standard wire single head 5mm tinned
Internal resistance: 0.8~0.9Ω (ambient temperature 23±1℃, 1kHZ Ac test)
Large temperature difference: above 62℃
Working current: Imax=11.8A (15A when starting with a large voltage of 15.5V)
Rated voltage: DC12V (large voltage: 15.5V)
Refrigeration power: 142W (Excessively high heat dissipation surface temperature will reduce the cooling power)
Assembly pressure: 85N/cm2
Working environment: temperature range -55℃～83℃ (too high ambient temperature will directly affect the cooling efficiency)
Encapsulation process: standard 704 silicone rubber seal all around
Packing standard: foam box packaging, storage conditions Ambient temperature -10℃～40℃
Storage conditions: -40~60℃
Power requirements: a single voltage 12V, current 15A or more working power supply (can be used in series and parallel)
Device characteristics: the red line is positive, the black line is negative (the literal is the cooling surface, and the non-literal is the heat dissipation surface)
Package Included: 1 pc
